Buchkapitel (16)
601.
Buchkapitel
3, Second edition 2020 Aufl., S. 1361 - 1379 (Hg. Andreoni, W.; Yip, S.). Springer, Cham (2020)
Polymer solutions. In: Handbook of Materials Modeling, Bd. 602.
Buchkapitel
3, Second edition 2020 Aufl., S. 1355 - 1360 (Hg. Andreoni, W.; Yip, S.). Springer, Cham (2020)
Soft Matter / Polymer Simulations and Bridging Scales: Overview. In: Handbook of Materials Modeling: Methods: Theory and Modeling, Bd. 603.
Buchkapitel
Multiscale Concepts in Simulations of Organic Semiconductors. In: Handbook of Materials Modeling (Hg. Andreoni, W.; Yip, S.). Springer, Cham (2018)
604.
Buchkapitel
Data-Driven Methods in Multiscale Modeling of Soft Matter. In: Handbook of Materials Modeling, S. 1 - 12 (Hg. Andreoni, W.; Yip, S.). Springer, Cham (2018)
605.
Buchkapitel
Top-Down Hybrid Models of Polymers. In: Handbook of Materials Modeling: Methods: Theory and Modeling, S. 1 - 20 (Hg. Andreoni, W.; Yip, S.). Springer, Cham (2018)
606.
Buchkapitel
The (Non-)Local Density of States of Electronic Excitations in Organic Semiconductors Supervisor's Foreword. In: Springer Theses. Springer, Berlin (2018)
607.
Buchkapitel
Adaptive Resolution Molecular Dynamics Technique. In: Handbook of Materials Modeling, S. 1 - 15 (Hg. Andreoni, W.; Yip, S.). Springer, Cham (2018)
608.
Buchkapitel
Variationally Enhanced Sampling. In: Handbook of Materials Modeling: Methods: Theory and Modeling, S. 1 - 14 (Hg. Andreoni , W.; Yip, S.). Springer, Cham (2018)
609.
Buchkapitel
Networks: From Rubbers to Food. In: Designing of Elastomer Nanocomposites: From Theory to Applications, S. 187 - 233 (Hg. Stöckelhuber, K.; Das, A.; Klüppel , M.). Springer, Cham (2017)
610.
Buchkapitel
Modeling of organic light emitting diodes: from molecular to device properties. In: Organic Light Emitting Materials and Devices XX, 99411B (Hg. So, F.; Adachi, C.; Kim, J. J.). SPIE, Bellingham, Washington (2016)
611.
Buchkapitel
Simulation of Dimensionality Effects in Thermal Transport. In: Thermal Transport in Low Dimensions: From Statistical Physics to Nanoscale Heat Transfer, S. 275 - 304 (Hg. Lepri, S.). Springer International Publishing, Cham, Switzerland (2016)
612.
Buchkapitel
Molecular scale simulation of hole mobility and current densities in amorphous tridecane. In: Electrical Insulation and Dielectric Phenomena (CEIDP), 2015 IEEE Conference on, S. 14 - 18. IEEE, New York, NY (2015)
613.
Buchkapitel
Simulations of Morphology and Charge Transport in Supramolecular Organic Materials. In: Supramolecular Materials for Opto-Electronics, S. 309 - 362 (Hg. Koch , N.). Royal Society of Chemistry, Cambridge (2014)
614.
Buchkapitel
Mechanical Properties of Single Molecules and Polymer Aggregates. In: From Single Molecules to Nanoscopically Structured Materials, S. 1 - 60 (Hg. Basche, T.; Müllen, K.; Schmidt, M.). Springer International Publishing (2014)
615.
Buchkapitel
Computational Studies of Biomembrane Systems: Theoretical Considerations, Simulation Models, and Applications. In: From Single Molecules to Nanoscopically Structured Materials, S. 237 - 283 (Hg. Basche, T.; Müllen, K.; Schmidt, M.). Springer International Publishing (2014)
616.
Buchkapitel
Morphology and Charge Transport in P3HT: A Theorist's Perspective. In: P3HT Revisited – From Molecular Scale to Solar Cell Devices, S. 139 - 180 (Hg. Ludwigs , S.). Springer, Berlin Heidelberg (2014)
Konferenzbeitrag (10)
617.
Konferenzbeitrag
49, S. 127 - 135 (Hg. Binder, K.; Müller, M.; Trautmann, A.). NIC Symposium, Jülich, 22. Februar 2018 - 23. Februar 2018. John von Neumann Institute for Computing (NIC), Jülich (2018)
Insights into Molecular Recognition: Multi-Resolution Simulations of Proteins and their Hydration Shells to Capture both Global Fluctuations and Chemical Detail. In: NIC Series, Bd. 618.
Konferenzbeitrag
49, S. 303 - 312 (Hg. Binder, K.; Müller, M.; Trautmann, A.). NIC Symposium, Jülich, 22. Februar 2018 - 23. Februar 2018. John von Neumann Institute for Computing (NIC), Jülich (2018)
Hierarchical Modelling of Entangled Polymer Melts: Structure and Rheology. In: NIC Series, Bd. 619.
Konferenzbeitrag
Energy-Stable Numerical Schemes for Multiscale Simulations of Polymer-Solvent Mixtures. In: Mathematical Analysis of Continuum Mechanics and Industrial Applications II, S. 153 - 165 (Hg. Van Meurs, P.). CoMFoS16 International Conference on Mathematical Analysis of Continuum Mechanics and Industrial Applications II, Kyushu Univ, Fukuoka, Japan, 22. Oktober 2016 - 24. Oktober 2016. Springer, Singapore (2018)
620.
Konferenzbeitrag
48, S. 259 - 260 (Hg. Binder, K.; Müller, M.; Kremer, M.; Schnurpfeil, A.). NIC Symposium, Jülich, 11. Februar 2016 - 12. Februar 2016. John von Neumann Institute for Computing (NIC), Jülich (2016)
Introduction to Section Computational Soft Matter. In: NIC Series, Bd.